FG200
FG200

・Air Interface: Sub-6

・Package: LGA

・Dimensions: 45.0 x 48.0 x 2.75 mm

・Operating Voltage: 3.3V ~ 4.4V(Typical 3.8V)

・Operating Temperature: -40°C ~ +85°C

Product Overview
Product Specifications
Fibocom FG200 is a high-performance Sub-6 wireless communication module.
The module adopts a LGA package with dimensions of 45.0 x 48.0 x 2.75 mm and an operating temperature range of -40°C ~ +85°C.
Its rich interfaces support a wide range of wireless terminals and IoT applications.

Basic Features
Air Interface Sub-6
Package LGA
Dimension (mm) 45.0 x 48.0 x 2.75
Frequency Bands -NA (North
America)
Sub-6: n2/5/7/12/14/25/26/29/30/38/41/
48/66/70/71/77/78
LTE FDD: B2/4/5/7/12/13/14/17/25/26/
29/30/66/71
LTE TDD: B38/41/42/43/48
Operation mode NSA&SA
Antenna 8(Sub-6) + 1(GNSS)
Power Supply 3.3V ~ 4.4V(Typical 3.8V)
Operating Temp. -40°C ~ +85°C
Key Functions
NR MIMO DL 4x4 MIMO: n2/5/7/12/14/25/26/30/38/41/48/66/70/71/77/78
UL 2x2 MIMO: n25/41/48/66/71/77/78
LTE MIMO DL 4x4 MIMO: B2/4/5/7/12/13/14/17/25/26/30/38/41/42/43/48/
66/71
NR SA(Mbps) 10280(DL)/1800(UL)
NR ENDC(Mbps) 5940(DL)/555(UL)
LTE(Mbps) 2000(DL)/211(UL)
WCDMA(Mbps)
Functions
Voice VoLTE & VoNR(Optional)
SMS SMS over IP(IMS)
Audio
FOTA
OS Drivers Windows/Linux/Android
GNSS GPS/GLONASS/Galileo/BeiDou/QZSS/NavIC
Interfaces
USB USB3.1/3.0/2.0
PCIe PCIe4.0/3.0
UART
SPI
GPIO
I2C
SDIO
UIM
I2S
MIPI
RGMII USXGMII
Certification
Regulation FCC*/IC*
Operator *
Industry PTCRB*/GCF*
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