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Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System at MWC Barcelona 2023

DuringMWC Barcelona 2023, Fibocom to unveil the 5G Sub-6GHz and mmWave module Fx190/Fx180series based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AIinnovations in architecture design, significantly improves 5G cellularcapabilities and spectrum utilization.

Barcelona, Spain –February 27th, 2023 – Fibocom Wireless Inc., a global leading provider of IoT(Internet of Things) wireless solutions and wireless communication modules, toannounce the launch of the leading-edge 5G Sub-6GHz and mmWave module Fx190(W)/Fx180(W)series at MWC Barcelona 2023. Adopting multiple innovations from the world’sfirst 5G Advanced-ready modem-RF system, Snapdragon X75 and X72, the modulesare set to bring outstanding cellular performance to mass data transmissionapplications such as mobile broadband, FWA, enterprise 5G, and IIoT.

Equipped with Qualcomm®5G AI Processor Gen 2, Snapdragon X75 is the world’s first modem-RF system witha dedicated AI tensor accelerator. With 2.5X improved AI performance over Gen1, allowing modules to significantly improve the 5G cellular capabilities withultra-fast speed performance, extended network coverage, and spectrumutilization. Powered by Snapdragon X75 and X72, and a quad-core A55 CPU, FibocomFx190(W)/Fx180(W) series provide superior 5G experience especially for FWAapplications, offering optimized power consumption and multiple Wi-Fi 7 selections.

Compliant with3GPP Release 17 standard, Fibocom FG190(W)/FM190(W) module series are adoptingLGA and M.2 form factors into module design, efficiently driving theflexibility and scalability in a various of IoT terminal devices. By leveragingthe spectrum resources for a broader reach of faster speeds, the module series supportSub-6 GHz and mmWave dual-connectivity, as well as NR 10CA with up to 1000MHz bandwidth in the mmWave frequency band, significantlyboosting the maximum downlink speed of up to 10Gbps.

In addition to the Fx190 series, Fibocom launches the FG180(W)/FM180(W)series based on the Snapdragon X72, which supports up to 400MHz bandwidth of NR4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz, themaximum downlink rate under the aggregation of the two can reach 4.4Gbps. TheFx180 series is optimized for the FWA market and supports multi-gigabit uplinkand downlink rates.

It is worth notingthat FM190(W)/FM180(W) series are M.2 standard and pin compatible with FibocomFM170/FM160/FM150 5G module series. However, FG190(W)/FG180(W) series aredesign to provide Open CPU solution with rich interfaces such as PCIe,Ethernet, USXGMII, UART, I2S, USB 3.1 and UIM. Featuring on the fast-growing 5GFWA market, FG190(W)/FG180(W) series offers a comprehensive module solution incombination with the latest Wi-Fi 7 technology, including Tri-band Wi-Fi 7 forCPE (BE19000) and Dual-band Wi-Fi 7 for MiFi (BE5800). Benefiting from theWi-Fi 7 capabilities such as 160MHz/320MHz bandwidth, 6GHz frequency band, 4096QAM,as well as Multi-Link Operation (MLO), ensuring the Wi-Fi network coverage and betterspeed experience in home, enterprise and manufacturing plants. It is worthnoting that the FG190(W)/FG180(W) series also supports wired networkdeployment, allowing maximum 10Gb Ethernet, satisfying different applicationrequirements. Fibocom Fx190(W)/Fx180(W) series alsosupports a variety of global operating systems, including OpenWRT and RDK-B, tofurther help customers reduce time to the market.

“We are excited tohave Fibocom develop module products incorporating the leading-edgecapabilities of our Snapdragon X75 and X72,” said Gautam Sheoran, vicepresident, product management, Qualcomm Technologies, Inc. “The unparalleledperformance and power efficiency of Snapdragon X75 and X72 in both Sub-6 andmmWave technologies ushers in the next phase of 5G evolution in all majorverticals such as FWA, Industrial IoT, and beyond.

“We are proud of cooperatingwith Qualcomm Technologies, the most valuable partner of Fibocom to launch theleading-edge 5G Sub-6GHz and mmWave module series Fx190(W)/Fx180(W) based onSnapdragon X75 and X72 at MWC Barcelona 2023,” said Dan Schieler, SVP of IoT OverseasSales Department, Fibocom. “It’s great to see that in terms of offering 5Gconnectivity service, we are now diving deep into more and more verticalmarkets to provide the improved quality of 5G service. FWA is a fast-growingand promising market, we have the confidence to deliver a high-efficient,best-in-the-market total solution for our customers.”

Qualcomm and Snapdragonare trademarks or registered trademarks of Qualcomm Incorporated.


Snapdragon andQualcomm branded products are products of Qualcomm Technologies, Inc. and/orits subsidiaries. Qualcomm patented technologies are licensed by QualcommIncorporated.

Related Topics: #Product Launch#5G IoT

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