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FG170-NA

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Air Interface:5G, 4G
Region: North America,
Fibocom FG170-NA is a 5G module designed specifically for the North American market, compliant with the 3GPP Release 16 standard. Powered by the Qualcomm Snapdragon SDX65 chipset, it delivers a superior 5G experience and unlocking greater potential for connected devices.
The module features a LGA packaging design with dimensions of 41x44x2.75mm, ensuring full compatibility with the 5G module FG160. In the 5G NR Sub-6GHz, it offers up to 300MHz bandwidth and supports downlink NR 4CA and 4x4 MIMO in the low-frequency band. Also, it delivers impressive maximum downlink rates of 4.2Gbps and uplink rates of 900Mbps within a 5G network.
The FG170-NA module supports a variety of network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. It can be applied in a wide range of IoT applications such as Customer Premises Equipment (CPE), HD live streaming, Industrial gateways, video surveillance, drones, VR/AR, and more.

5G Sub-6 GHz Module FG170

Based on Qualcomm SDX65, Fibocom's 5G Sub-6 GHz module FG170 delivers multi-gigabits speeds for FWA, Industrial IoT, private network, and other mass data scenarios.

Introduction: Harnessing the Potential of Qualcomm SDX65 with Fibocom FG170-NA

Fibocom, a global leader in wireless communication modules and solutions, is proud to introduce the FG170-NA, a cutting-edge 5G module designed specifically for the North American market. Powered by the advanced Qualcomm Snapdragon SDX65 chipset, the FG170-NA module delivers unparalleled performance, enabling multi-gigabit speeds and unlocking new possibilities for connected devices. With its adherence to the 3GPP Release 16 standard and the integration of the SDX65 chipset, Fibocom's FG170-NA module sets a new benchmark for 5G excellence, empowering businesses and consumers to experience the full potential of next-generation wireless connectivity.

Qualcomm SDX65: The Driving Force Behind FG170-NA's Superior 5G Performance

At the heart of Fibocom's FG170-NA module lies the Qualcomm Snapdragon SDX65 chipset, a testament to Qualcomm's leadership in 5G technology. The SDX65 chipset is a powerhouse of innovation, engineered to deliver exceptional performance, energy efficiency, and reliability. By leveraging the advanced capabilities of the Qualcomm SDX65, the FG170-NA module offers a superior 5G experience, with support for Sub-6GHz frequencies and impressive data rates. The module boasts up to 300MHz bandwidth in the 5G NR Sub-6GHz band, enabling downlink NR 4CA and 4x4 MIMO in the low-frequency band. This translates to maximum downlink rates of 4.2Gbps and uplink rates of 900Mbps within a 5G network, empowering businesses and consumers to enjoy lightning-fast connectivity and seamless data transfer.

Compact Design and Versatile Functionality: The Hallmarks of FG170-NA with Qualcomm SDX65

Fibocom's FG170-NA module, powered by the Qualcomm SDX65 chipset, is designed with versatility and ease of integration in mind. With its compact LGA packaging and dimensions of 41x44x2.75mm, the module ensures full compatibility with the 5G module FG160, allowing for seamless upgrades and future-proofing of devices. The FG170-NA module supports a wide range of network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. This rich set of interfaces enables the module to be applied in a diverse array of IoT applications, from Customer Premises Equipment (CPE) and HD live streaming to industrial gateways, video surveillance, drones, and VR/AR. With the power of the Qualcomm SDX65 chipset, the FG170-NA module delivers uncompromising performance and flexibility, making it an ideal choice for businesses seeking to harness the full potential of 5G technology.

Empowering IoT Applications with FG170-NA and Qualcomm SDX65

The Fibocom FG170-NA module, powered by the Qualcomm SDX65 chipset, is a game-changer for IoT applications, enabling businesses to unlock new levels of efficiency, productivity, and innovation. With its support for Sub-6GHz frequencies and impressive data rates, the FG170-NA module is particularly well-suited for applications that demand high-speed, low-latency connectivity. In the realm of Customer Premises Equipment (CPE), the module enables ultra-fast broadband access, empowering households and businesses with seamless streaming, video conferencing, and cloud computing capabilities. For industrial gateways and video surveillance systems, the FG170-NA module powered by the Qualcomm SDX65 ensures reliable, high-quality data transmission, enabling real-time monitoring, remote control, and predictive maintenance. In the exciting fields of drones and VR/AR, the module's superior performance and low latency unlock immersive experiences, precise control, and seamless integration with cloud-based services. With the FG170-NA and Qualcomm SDX65, the possibilities for IoT innovation are limitless.

Fibocom's Commitment to Quality and Reliability with SDX65 Integration

Fibocom is renowned for its unwavering commitment to quality and reliability, and the FG170-NA module with the Qualcomm SDX65 chipset is no exception. By integrating the SDX65, Fibocom ensures that the FG170-NA module delivers optimal performance, energy efficiency, and durability in diverse operating conditions. The module undergoes rigorous testing and certification processes, including FCC and IC regulatory certifications, as well as PTCRB and GCF industry certifications (planned/under development). Fibocom's dedication to quality extends beyond hardware, with comprehensive software support, regular updates, and expert technical assistance provided to customers throughout the product lifecycle. With Fibocom and the Qualcomm SDX65 chipset, businesses can confidently deploy 5G solutions, knowing that they have access to a reliable, high-performance module that drives their success in the digital era.

Conclusion: Shaping the Future of 5G with Fibocom FG170-NA and Qualcomm SDX65

As the world embraces the transformative potential of 5G technology, Fibocom's FG170-NA module, powered by the Qualcomm Snapdragon SDX65 chipset, stands at the forefront of innovation. By harnessing the capabilities of the SDX65 and delivering unparalleled performance, the FG170-NA module empowers businesses and consumers to experience the full benefits of 5G connectivity. With its compact design, versatile functionality, and support for a wide range of IoT applications, the FG170-NA module is poised to shape the future of wireless communication in the North American market. As businesses increasingly recognize the importance of 5G in driving digital transformation and competitive advantage, Fibocom's FG170-NA module with the Qualcomm SDX65 chipset emerges as the ideal solution, offering speed, reliability, and flexibility. By partnering with Fibocom and leveraging the power of the FG170-NA and SDX65, businesses can confidently navigate the evolving 5G landscape and unlock new opportunities for growth in the digital age.

 

Product Specifications

Basic Features

Package LGA
Dimension(mm) 41x44x2.75
Sub-6 n2/5/7/12/14/25/30/48/41/70/66/71/77/78
mmWave NA
LTE FDD B2/4/5/7/12/13/29/30/66/71
LTE TDD B41/48/46
WCDMA NA
Operation mode NSA&SA
Antenna 4/6/8+1(GNSS)
Operating Voltage 3.3V~4.4V(Typical 3.8V)
Operating Temp. -30°C - +75°C

Key Functions

NR MIMO DL 4×4MIMO: n2/5/7/12/14/25/30/41/48/66/70/71/77/78
UL 2×2MIMO: n41/77
LTE MIMO DL 4×4MIMO: B2/4/5/7/12/13/30/41/48/66/71
NR SA(Mbps) 4120(DL)/900(UL)
NR ENDC(Mbps) 4060(DL)/555(UL)
LTE(Mbps) 1600(DL)/211(UL)
WCDMA(Mbps) 42(DL)/5.76(UL)

Functions

Voice VoLTE & VoNR(Optional)
SMS SMS over IP(IMS)
Audio
FOTA
OS Drivers Windows/Linux/Android
GNSS GPS/GLONASS/Galileo/BeiDou/QZSS

Interfaces

USB USB3.1/3.0 & USB2.0
PCle PCIe4.0
UART
SPI
GPIO
I2C
SDIO
UIM
I2S
MIPI
RGMII NA

Certification

Regulation FCC*/IC*
Operator NA
Industry PTCRB*/GCF*
* =planning /under development

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