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LE230
LE230

・Air Interface:LTE Cat.1

・Package:LCC+LGA

・Dimensions:21.9 x 22.9 x 2.4mm

・Operating Voltage:3.4V ~ 4.5V (Typical 3.8V)

・Operating Temp.:-35°C ~ +75°C

Product Overview
Product Specifications

LE230 is a high-performance LTE Cat1 bis wireless communication module. It adopts LCC+LGA packaging, with dimensions of (21.9±0.15) mm x (22.9±0.15) mm x (2.4±0.2) mm, and supports 4G frequency bands of domestic operators.

The LE230 is equipped with a built-in CODEC, supports WiFi-Scan, has a rich set of built-in network protocols, integrates multiple common interfaces, and supports various drivers and software functions (such as mainstream operating systems like Windows/Linux), meeting the various application requirements of the IoT industry.

The product is positioned to cover the medium and low-rate Internet of Things market, such as ATM/POS, sharing economy, cloud speakers and many other application scenarios, providing perfect wireless experiences for customers in the abovementioned fields.

Basic Features
Package LCC+LGA
Dimension (mm) 21.9 x 22.9 x 2.4
Frequency Bands -CN (China) LTE FDD: B1/3/5/8
LTE TDD: B34/38/39/40/41
-EU (Europe) LTE FDD:B1/3/5/7/8/20/28F
LTE TDD:B38/40/41
Power Supply 3.4V ~ 4.5V (Typical 3.8V)
Operating Temp. -35°C ~ +75°C
Data Transmission
LTE FDD (Mbps) 10(DL) / 5(UL)
LTE TDD (Mbps) 9.1(DL)/3.1 (UL)
DC-HSPA+(Mbps) NA
HSPA/HSPA+(Mbps) NA
WCDMA(Kbps) NA
TD-SCDMA (Mbps) NA
EVDO(Mbps) NA
CDMA2000 1X(Kbps) NA
EDGE(Kbps) NA
GPRS(Kbps) NA
Functions
Wi-Fi scan
Bluetooth NA
SIM
eSIM NA
eCALL NA
OpenCPU Optional
MUX
Dual SIM
Jamming Detection
USSD NA
STK
LBS
FOTA DFOTA
OS Drivers Linux/Windows/Android
GNSS NA
VOLTE Optional
CSD NA
TTS Optional
SMS SGs/IMS
Audio
Voice Code NA
Audio Play/Record Optional
Protocols TCP/UDP/HTTP/HTTPS/FTP/FTPS/MQTT/SSL/TLS/IPV6
Interfaces
SIM x 1, 1.8V/3.0V
USB x 1, USB2.0
PCIe NA
UART x 3
SPI
ADC
GPIO
Certification
Regulation -CN: RoHS2.0/SRRC/CCC
-EU: RoHS2.0/REACH
Operator -CN: CTCC*/CMCC*
Industry -EU: HF
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