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FG180-NA

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Sub6
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GNSS
Air Interface:5G
Region: North America,
Fibocom FG180-NA is a 5G wireless Module designed for the North American market, compliant with the 3GPP Release 17 standard. Powered by the Qualcomm snapdragon SDX72, it provides a superior 5G experience and optimized power consumption, especially for the FWA market and application. The module features a new LGA packaging design with dimensions of 45*48*2.75mm. The NR Sub-6GHz offers up to 300MHz bandwidth and downlinks NR 5CA, FDD+FDD uplink carrier aggregation, and FDD uplink MIMO, which offers an excellent 5G high-speed experience. The FG180-NA features rich network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. It can be applied in IoT applications such as CPE, mobile hotspots, gateways, video surveillance, drones, VR/AR, and more.

5G Sub-6 GHz Module FG180

Fibocom FG180-NA is a 5G module compliant with the 3GPP Release 17 standard. Powered by the Qualcomm snapdragon SDX72, it provides a superior 5G experience and optimized power consumption, especially for the FWA market and application.

Introduction: FG180-NA and SDX72 - A Winning Combination for 5G Excellence

Fibocom, a global leader in wireless communication modules and solutions, is proud to introduce the FG180-NA, a cutting-edge 5G wireless module designed specifically for the North American market. Powered by the advanced Qualcomm Snapdragon SDX72 chipset, the FG180-NA module delivers a superior 5G experience, optimized power consumption, and enhanced connectivity, making it the ideal choice for Fixed Wireless Access (FWA) applications and beyond. With its adherence to the 3GPP Release 17 standard and the integration of the SDX72 chipset, Fibocom's FG180-NA module sets a new benchmark for 5G performance, reliability, and efficiency.

SDX72: The Driving Force Behind FG180-NA's Exceptional 5G Performance

At the heart of Fibocom's FG180-NA module lies the Qualcomm Snapdragon SDX72 chipset, a testament to Qualcomm's leadership in 5G technology. The SDX72 chipset is a powerhouse of innovation, engineered to deliver exceptional performance, energy efficiency, and advanced features. By leveraging the capabilities of the SDX72, the FG180-NA module offers a superior 5G experience, with support for Sub-6GHz frequencies and impressive data rates. The module boasts up to 300MHz bandwidth in the NR Sub-6GHz band, enabling downlink NR 5CA, FDD+FDD uplink carrier aggregation, and FDD uplink MIMO, delivering an exceptional 5G high-speed experience. With the power of the SDX72 chipset, the FG180-NA module achieves remarkable performance, with downlink speeds of up to 4.12Gbps and uplink speeds of up to 900Mbps in standalone (SA) mode, and downlink speeds of up to 4.096Gbps and uplink speeds of up to 555Mbps in non-standalone (NSA) mode.

FG180-NA's Compact Design and Multi-Band Support: Empowered by SDX72

Fibocom's FG180-NA module, powered by the SDX72 chipset, boasts a compact and efficient design, making it suitable for a wide range of devices and applications. The module features a new LGA packaging design with dimensions of 45x48x2.75mm, ensuring compatibility with space-constrained devices while maintaining optimal performance. The FG180-NA module supports an extensive array of frequency bands, including Sub-6GHz bands (n2/5/7/12/14/25/26/29/30/38/41/48/66/70/71/77/78), LTE FDD bands (B2/4/5/7/12/13/14/17/25/26/29/30/66/71), LTE TDD bands (B38/41/42/43/48), and UMTS bands (B1/2/3/4/5/6/8/9/19). This comprehensive band support ensures seamless connectivity across different network standards and enables the module to operate effectively in various geographical regions. With the SDX72 chipset at its core, the FG180-NA module offers a winning combination of compact design, multi-band support, and exceptional performance.

Versatile Connectivity and Rich Interfaces: FG180-NA's Strength with SDX72

The Fibocom FG180-NA module, powered by the SDX72 chipset, offers versatile connectivity options and a rich set of interfaces, making it suitable for a wide range of IoT applications. The module supports advanced MIMO configurations, including 4x4 MIMO in the downlink for 5G NR bands (n2/5/7/12/14/25/26/30/38/41/48/66/70/71/77/78) and LTE bands (B2/4/5/7/12/13/14/17/25/26/30/38/41/42/43/48/66/71), as well as 2x2 MIMO in the uplink for 5G NR bands (n25/41/48/66/71/77/78). This enhanced MIMO support, enabled by the SDX72 chipset, ensures robust and reliable connectivity, even in challenging environments. The FG180-NA module also features rich network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, UART, SPI, GPIO, I2C, SDIO, UIM, I2S, MIPI, and USXGMII, providing flexibility and ease of integration for various IoT applications such as CPE, mobile hotspots, gateways, video surveillance systems, drones, and VR/AR devices.

FG180-NA's Enhanced Location Services and Voice Capabilities: Powered by SDX72

In addition to its exceptional 5G performance and versatile connectivity, the Fibocom FG180-NA module, powered by the SDX72 chipset, offers advanced location services and voice capabilities. The module supports multi-constellation GNSS (Global Navigation Satellite System), including GPS, GLONASS, Galileo, BeiDou, QZSS, and NavIC, enabling precise positioning and navigation for IoT devices. This feature is particularly valuable for applications that require accurate location tracking, such as asset management, fleet monitoring, and autonomous vehicles. Furthermore, the FG180-NA module supports VoLTE (Voice over LTE) and VoNR (Voice over New Radio), enabling high-quality voice services over 5G networks. With the power of the SDX72 chipset, the module delivers crystal-clear voice calls and seamless connectivity, enhancing the user experience in voice-enabled IoT applications.

Fibocom's Commitment to Quality and Reliability: FG180-NA and SDX72

Fibocom is renowned for its unwavering commitment to quality and reliability, and the FG180-NA module powered by the SDX72 chipset is no exception. The module undergoes rigorous testing and certification processes to ensure optimal performance, stability, and compliance with industry standards. Fibocom's dedication to quality extends beyond the hardware itself, with comprehensive software support, regular updates, and expert technical assistance provided to customers throughout the product lifecycle. By leveraging the advanced capabilities of the SDX72 chipset and Fibocom's expertise in wireless communication, the FG180-NA module delivers unparalleled performance, reliability, and efficiency for 5G IoT applications. With Fibocom and the SDX72 chipset, businesses can confidently deploy 5G solutions, knowing that they have access to a robust, future-proof, and high-performance module that drives their success in the evolving 5G landscape.

 

Product Specifications

Basic Features

Package LGA
Dimension (mm) 45x48x2.75
Sub-6

n2/5/7/12/14/25/26/29/30/38/41/48/66/70/71/77/78

8RX
n25/66/41/77

UMTS

LTE FDD

B1/2/3/4/5/6/8/9/19

B2/4/5/7/12/13/14/17/25/26/29/30/66/71

LTE TDD B38/41/42/43/48
MIMO

5G NR: DL 4x4 MIMO:n2/5/7/12/14/25/26/30/38/41/48/66/70/71/77/78

UL 2x2 MIMO:n25/41/48/66/71/77/78

LTE: DL 4x4 MIMO: B2/4/5/7/12/13/14/17/25/26/30/38/41/42/43/48/66/71

Operation mode NSA&SA
Antenna 4
Operating Voltage 3.135V~4.4V, Typical 3.8V
Operating Temp. -40°C - +85°C


Key Functions

FR1+FR2

NR SA(Mbps)

NA

4.12Gbps(DL) / 900Mbps(UL)

NR NSA(Mbps) 4.096Gbps(DL) / 555Mbps(UL)
LTE(Mbps) 2.0Gbps(DL) / 211Mbps(UL)


Functions

Voice VoLTE*/VONR*
SMS SMS over IP(IMS)
Audio
DFOTA
GNSS
GNSSGPS/GLONASS/Galileo/BeiDou/QZSS/NavIC

Interfaces

USB USB3.1/3.0 & USB2.0
PCle PCIe4.0/3.0x 1+PCIe3.0 x 2
UART
SPI
GPIO
I2C
SDIO
UIM
I2S
MIPI x2
USXGMII USXGMII x 2

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