5G Sub-6 GHz Module FM160
Find out how Qualcomm SDX62-integrated 5G module FM160 is bridging the digital divide with incomparable speed of up to 3.5Gbps DL and 900Mbps UL.
Introduction: Introducing Fibocom FM160-EAU and Qualcomm SDX62
Fibocom, a global leader in wireless communication modules and solutions, is proud to introduce the FM160-EAU, a cutting-edge 5G Sub-6 GHz module powered by the Qualcomm Snapdragon® X62 modem chipset. Designed to bridge the digital divide and empower IoT applications with unprecedented speeds of up to 3.5Gbps downlink and 900Mbps uplink, the FM160-EAU module is a testament to Fibocom's commitment to innovation and its partnership with Qualcomm Technologies, Inc.
Qualcomm SDX62: The Powerhouse Behind FM160-EAU's 5G Performance
At the heart of Fibocom's FM160-EAU module lies the Qualcomm Snapdragon® X62 modem chipset, a true powerhouse of 5G technology. The SDX62 chipset enables the module to deliver maximum downlink rates of 3.5Gbps and uplink rates of 900Mbps under 5G, making it an ideal choice for IoT applications that demand high data throughput and low latency. With support for 3GPP Release 16 and backward compatibility with LTE/WCDMA network standards, the FM160-EAU module, powered by the Qualcomm SDX62, ensures seamless connectivity and future-proofing for businesses investing in 5G IoT solutions.
Compact Design and Rich Interfaces: FM160-EAU with Qualcomm SDX62
Fibocom's FM160-EAU module, powered by the Qualcomm SDX62 chipset, boasts a compact M.2 form factor measuring just 30x52x2.3mm, making it compatible with Fibocom's existing 5G module FM150. This compatibility allows for easy upgrades and seamless integration into a wide range of devices. Despite its compact size, the FM160-EAU module offers a rich set of interfaces, including USIM, USB 3.1/3.0, PCIe 4.0, and PCM/I2S, providing flexibility and ease of integration for customers' applications. Additionally, the module supports multi-constellation GNSS receiver (GPS/Galileo/GLONASS/BeiDou), enabling high-performance positioning and navigation while simplifying product design. With the Qualcomm SDX62 at its core, the FM160-EAU module delivers unparalleled performance and functionality in a compact package.
Empowering IoT Applications with FM160-EAU and Qualcomm SDX62
The Fibocom FM160-EAU module, powered by the Qualcomm SDX62 chipset, is designed to empower a wide range of IoT applications that require high-speed, reliable, and low-latency connectivity. From Customer Premises Equipment (CPE) and Set-Top Boxes (STB) to Industrial PCs (IPC) and Outdoor Units (ODU), the FM160-EAU module provides a versatile solution for various cellular terminals. With support for multiple Internet protocols and industry-standard interfaces for main operating systems, including Windows, Linux, and Android, the module ensures compatibility and ease of integration across different platforms. The Qualcomm SDX62 chipset enables the FM160-EAU to deliver exceptional performance, making it suitable for applications such as high-definition video streaming, real-time data analytics, remote monitoring, and control in industries ranging from manufacturing and transportation to healthcare and smart cities.
Global Connectivity and Certifications: FM160-EAU with Qualcomm SDX62
Fibocom's FM160-EAU module, powered by the Qualcomm SDX62 chipset, is designed to provide global connectivity, covering mobile networks in Latin America and Europe. The module supports a wide range of frequency bands, including Sub-6 GHz bands (n1/3/5/7/8/20/28/38/40/41/75/76/77/78), LTE FDD bands (B1/3/5/7/8/20/28/32), LTE TDD bands (B38/40/41/42/43), and WCDMA bands (B1/5/8). This comprehensive coverage ensures that devices equipped with the FM160-EAU module can operate seamlessly across different regions and network standards. Moreover, the module has obtained CE and RCM certifications, demonstrating its compliance with stringent regulatory requirements. With the power of the Qualcomm SDX62 chipset and Fibocom's expertise in wireless communication, the FM160-EAU module offers global connectivity and reliability for IoT deployments worldwide.
Fibocom and Qualcomm: Driving 5G Innovation with SDX62
The collaboration between Fibocom and Qualcomm Technologies, Inc. exemplifies the commitment of both companies to drive 5G innovation and empower the IoT ecosystem. By leveraging the advanced capabilities of the Qualcomm Snapdragon® X62 modem chipset, Fibocom's FM160-EAU module delivers unparalleled performance, efficiency, and reliability. The Qualcomm SDX62 chipset, known for its cutting-edge 5G technology, enables the module to support advanced features such as 4x4 MIMO, carrier aggregation, and dual connectivity, ensuring optimal network performance and user experience. Through this partnership, Fibocom and Qualcomm aim to accelerate the adoption of 5G in the IoT landscape, enabling businesses to unlock new opportunities, drive digital transformation, and create innovative solutions that shape the future of connected industries.
