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FM190-GL

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Sub6
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GNSS
Air Interface:5G
Region: Global*,

Fibocom FM190-GL is a 5G Sub-6GHz Module compliant with the 3GPP Release 17 standard. Powered by the Qualcomm Snapdragon SDX75, it supports both 5Gstandalone (SA) and non-standalone (NSA) network architectures, which provide superior 5G experience connectivity and delivers optimized power consumption benefits for IoT applications.

The module is in an M.2 form factor with dimensions of30*52*2.3mm, which offers up to 300MHz bandwidth and downlink NR 5CA, FDD+FDD uplink carrier aggregation, and FDD uplink MIMO in the NR Sub-6GHz, which delivering a high-speed experience in the home, enterprise and manufacturing plants. The FM190W-GL features rich network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. It can be applied in gateways, video surveillance, industrial routers, drones, VR/AR, and more.

5G Sub-6GHz & mmWave module FM190W-GL

Adopting multiple innovations from the world’s first 5G Advanced-ready modem-RF system, Snapdragon X75, the FM190W-GL is set to bring outstanding cellular performance to mass data transmission applications such as mobile broadband, FWA, enterprise 5G, and IIoT.

Introduction: Revolutionizing 5G Connectivity with Fibocom FM190-GL and Qualcomm SDX75

Fibocom, a global leader in wireless communication modules and solutions, is proud to introduce the FM190-GL, a cutting-edge 5G Sub-6GHz module that redefines the boundaries of cellular performance. Powered by the Qualcomm Snapdragon SDX75, the world's first 5G Advanced-ready modem-RF system, the FM190-GL module is set to revolutionize mass data transmission applications such as mobile broadband, Fixed Wireless Access (FWA), enterprise 5G, and Industrial IoT (IIoT). With its adherence to the 3GPP Release 17 standard and the integration of the Qualcomm SDX75, Fibocom's FM190-GL module offers unparalleled 5G experiences, optimized power consumption, and seamless connectivity for IoT applications.

3GPP Release 17 Standard and Qualcomm SDX75: The Driving Forces Behind FM190-GL's Excellence

The Fibocom FM190-GL module is compliant with the 3GPP Release 17 standard, which represents a significant milestone in the evolution of 5G technology. Release 17 introduces a range of enhancements and innovations, including improved network efficiency, enhanced mobile broadband experiences, and advanced support for IoT applications. By adhering to this standard and leveraging the power of the Qualcomm Snapdragon SDX75 modem-RF system, the FM190-GL module delivers superior 5G performance and future-proofs IoT devices for the rapidly evolving 5G landscape. The Qualcomm SDX75, with its advanced features and capabilities, enables the FM190-GL to support both standalone (SA) and non-standalone (NSA) network architectures, ensuring seamless connectivity and optimal power consumption for IoT applications.

Compact Form Factor and Extensive Bandwidth: FM190-GL's Winning Combination with Qualcomm SDX75

Fibocom's FM190-GL module, powered by the Qualcomm SDX75, boasts a compact M.2 form factor with dimensions of 30x52x2.3mm, making it an ideal choice for space-constrained IoT devices. Despite its compact size, the FM190-GL module offers an impressive array of features and capabilities. It supports up to 300MHz bandwidth in the NR Sub-6GHz band, enabling lightning-fast data transmission and enhanced network capacity. The module also supports downlink NR 5CA, FDD+FDD uplink carrier aggregation, and FDD uplink MIMO, delivering a high-speed 5G experience in various environments, including homes, enterprises, and manufacturing plants. With the Qualcomm SDX75 at its core, the FM190-GL module achieves remarkable performance, with downlink speeds of up to 6.18Gbps and uplink speeds of up to 900Mbps in standalone (SA) mode, and downlink speeds of up to 4.92Gbps and uplink speeds of up to 555Mbps in non-standalone (NSA) mode.

Versatile Connectivity and Rich Interfaces: Empowering IoT Applications with FM190-GL and Qualcomm SDX75

The Fibocom FM190-GL module, powered by the Qualcomm SDX75, is designed to cater to a wide range of IoT applications, offering versatile connectivity options and a rich set of interfaces. The module supports an extensive array of frequency bands, including Sub-6GHz bands (n1/2/3/5/7/8/12/13/14/18/20/25/26/29/30/34/38/39/40/41/46/48/53/66/67/68/70/71/75/76/77/78/79/90/91/92/93/94), LTE FDD bands (B1/2/3/4/5/7/8/12/13/14/17/18/19/20/25/26/28/29/30/32/66/70/71/75/76), LTE TDD bands (B34/38/39/40/41/48/46/53), and UMTS bands (B1/2/3/4/5/6/8/9/19). This comprehensive band support ensures global compatibility and enables IoT devices to operate seamlessly across different regions and network standards. The FM190-GL module also features rich network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, and I2S, providing flexibility and ease of integration for various IoT applications such as gateways, video surveillance systems, industrial routers, drones, and VR/AR devices.

Enhanced Location Services and Voice Capabilities: FM190-GL's Advantage with Qualcomm SDX75

In addition to its exceptional 5G performance and versatile connectivity, the Fibocom FM190-GL module, powered by the Qualcomm SDX75, offers advanced location services and voice capabilities. The module supports multi-constellation GNSS (Global Navigation Satellite System), including GPS, GLONASS, Galileo, BeiDou, QZSS, and NavIC, enabling precise positioning and navigation for IoT devices. This feature is particularly valuable for applications that require accurate location tracking, such as asset management, fleet monitoring, and autonomous vehicles. Furthermore, the FM190-GL module supports VoLTE (Voice over LTE) and VoNR (Voice over New Radio), enabling high-quality voice services over 5G networks. With the power of the Qualcomm SDX75, the module delivers crystal-clear voice calls and seamless connectivity, enhancing the user experience in voice-enabled IoT applications.

Fibocom and Qualcomm: Driving 5G Innovation with SDX75

The collaboration between Fibocom and Qualcomm Technologies, Inc. exemplifies the commitment of both companies to drive 5G innovation and empower the IoT ecosystem. By leveraging the advanced capabilities of the Qualcomm Snapdragon SDX75 modem-RF system, Fibocom's FM190-GL module delivers unparalleled 5G performance, efficiency, and reliability. The Qualcomm SDX75, a testament to Qualcomm Technologies' leadership in 5G technology, enables the FM190-GL module to support cutting-edge features and innovations, such as enhanced mobile broadband, advanced power-saving techniques, and robust security mechanisms. Through this partnership, Fibocom and Qualcomm Technologies aim to accelerate the adoption of 5G in the IoT landscape, enabling businesses to unlock new possibilities, drive digital transformation, and create innovative solutions that shape the future of connected industries.

 

Product Specifications

Basic Features

Package M.2
Dimension (mm) 30x52x2.3
Sub-6

n1/2/3/5/7/8/12/13/14/18/20/25/26/29/30/34/38/39/40/41/46/48/53/66/
67/68/70/71/75/76/77/78/79/90/91/92/93/94

mmWave

NA

UMTS

LTE FDD

B1/2/3/4/5/6/8/9/19

B1/2/3/4/5/7/8/12/13/14/17/18/19/20/25/26/28/29/30/32/66/70/71/75/76

LTE TDD B34/38/39/40/41/48/46/53
CDMA B0/1/10
Operation mode NSA&SA
Antenna 4
Operating Voltage 3.135V~4.4V, Typical 3.8V
Operating Temp. -40°C - +85°C

Key Functions

FR1+FR2

NR SA(Mbps)

NA

6.18Gbps(DL) / 900Mbps(UL)

NR NSA(Mbps) 4.92Gbps(DL) / 555Mbps(UL)
LTE(Mbps) 2.0Gbps(DL) / 211Mbps(UL)
CDMA(Mbps) B0/1/10

Functions

Voice VoLTE*/VONR*
SMS SMS over IP(IMS)
Audio
DFOTA
GNSS
GNSSGPS/GLONASS/Galileo/BeiDou/QZSS/NavIC

Interfaces

USB USB3.1/3.0 & USB2.0 x 1
PCle PCIe4.0/3.0x 1+PCIe3.0 x 2
UIM
I2S

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